Wafer grinding and cutting
At present, we have TskPG300RM grinding machine, DiscoDFD840 grinding machine, TskAD300TX scribing machine, DISCO/DFL7160 laser cutting machine and other imported semiconductor equipment, which can grind and cut 4-inch, 6-inch, 8-inch, 12-inch wafers, of which 4-inch, 6-inch, 8-inch wafer capacity of 7000 wafers / month, 12-inch wafer capacity of 2000 wafers/month.
DISCO/DFL7160 wafer laser slotting technology: currently is the semiconductor packaging, the most cutting-edge technology, the main slotting purpose is to improve the cutting quality of the product, and production efficiency. DFL7160 slotting before the diamond cut through, can effectively solve the subsequent diamond blade cutting back crash, positive crash, chip dark crack and other fatal quality accidents. Greatly improve the cutting quality of products. Main slotting 6, 8, 12 inch wafers.
Technical support contact number: 17521515206